Intel has tested the following motherboard/chassis combinations for minimum thermal performance compatibility with boxed Intel® Xeon® processors and their accompanying heat solutions. This listing is not intended to be all inclusive; it only represents motherboards Intel has tested. Users of this list are reminded to check with the motherboard and chassis manufacturer to ensure that a particular motherboard or chassis model is adequate for the intended purpose.
This list has been provided as an aid to in the system integration process. Intel has deemed the server board/chassis combinations listed below, when used with their included power supply units, meet MINIMUM thermal compatibility requirements to properly support the boxed Intel® Xeon® processors and their accompanying thermal solutions. These server board/chassis combinations were tested at an ambient room temperature of 35°C with the following components installed:
- 2 Boxed Intel® Xeon® Processor 5080
- 2 Boxed Intel® thermal solutions - either 1U passive, 2U passive or active, depending on chassis form factor
- Intel® Xeon® processors based Customer Reference Board (CRB) part No. C97294-204
- Intel® reference rear air duct
- 4 or 8 DDR2 FBDIMM 667MHz with Intel® Fully DIMM Heat Sink(FDHS) Rev.003 using PCM-45F TIM depending on configuration
- 4 Western Digital* 7200rpm 36.7GB WD360GD Raptor SATA or Seagate* Cheetah 120GB 7200rpm U320 SATA, depending on boards configuration
- Integrated ATI* graphic card
- LiteOn* CD-RW 52x CD/DVD Drive
- 3.5" Floppy Drive
The chassis and server board vendors remain solely responsible for the design, sale and functionality of their products, including any liability arising from product infringement or product warranty. CONTACT YOUR CHASSIS OR SERVER BOARD VENDOR FOR COMPATIBILITY INFORMATION REGARDING SPECIFIC MODELS.
Intel® Xeon® Processor-based Platform Tested Chassis List
| Supplier | Form Factor | Model Number | Notes |
| Intel | Pedestal | SC5299-E | 1 |
| SC5400 | |||
| 1U | SR1500 | ||
| SR1550 | |||
| 2U | SR2500 | ||
| AIC | 1.5U | RMC-15D-2 | |
| 2U | RMC-2F-2 | ||
| Chenbro | Pedestal | SR107 with 50H032108-001 (air duct) | 1 |
| SR108 with 50H032108-001 (air duct) | |||
| 1U | RM12602 | ||
| RM13106 | |||
| 2U | RM217 with 50H093217-001 (air duct) | 1 | |
| CI Design | 1U | RS1400 | |
| Enlight | Pedestal | SR506 | 1 |
| 1U | SR1074 | ||
| Ever Case | Pedestal | ECS5000LXD | 1 |
| In Win | Pedestal | IW-R3000NB | 1 |
| TST | 2U | ESR212 | 2 |
| Yeong Yang | Pedestal | YY-W201 | 1 |
| YY-W202 |
Notes:
1. Rear air duct was recommended for FBDIMM cooling in this pedestal chassis. It can be purchased together or as an additional accessory.
2. TST 2U chassis ESR212 passed thermal testing with 12HDDs at 35C.
SSI specifications and compliant power supply (or chassis) product postings are available at www.ssiforum.org
Intel reserves the right to modify this document at any time without notice. Intel assumes no responsibility for any errors which may appear in this document, nor does it make any commitment to update the information contained in it. Intel disclaims any liability or obligation for damages of any kind arising out of the application or use of the information contained in this document.
INTEL DISCLAIMS ALL WARRANTIES AND GUARANTEES, EXPRESS, IMPLIED OR OTHERWISE, ARISING FROM OR CONCERNING THE CONTENTS OF THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, AND ANY WARRANTY OF NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT OF ANY THIRD PARTY. INTEL MAKES NO CLAIMS OF COMPLIANCE WITH ANY GOVERNMENTAL REGULATORY AGENCY.
Intel does not convey any license, express or implied, by estoppel or otherwise, arising under its intellectual property rights, nor under the rights of others.
This information is for reference use by PC integrators only. PC integrators are not authorized to refer to Intel's testing activities in advertising or in any other manner whatsoever.

