Intel® 82870P2 PCI/PCI-X 64-bit Hub 2: Thermal Design Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting and/or passive heatsinks.
The goals of this document are to:
• Specify the operating limits of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) components.
• Describe two reference thermal solutions that meet the thermal specifications of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) component.
Properly designed solutions provide adequate cooling to maintain the P64H2 component die temperatures at or below thermal specifications. This is accomplished by providing a low local ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the P64H2 component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the P64H2 components only. For thermal design information on other chipset components, refer to the respective component datasheets. For the ICH3-S, refer to the Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet. For the ICH4, refer to the Intel® 82801DB I/O Controller Hub 4 (ICH4) Datasheet.
The information on the thermal solutions design provided in this document is for reference only, and suggests good thermal design practices. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following all of the instructions presented in this document will result in a system with adequate thermal performance.
Read the full Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 Thermal Design Guide.