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Intel® 852GME Chipset

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Intel® 852GME Chipset

The Intel® 852GME Chipset, optimized for the Mobile Intel® Pentium® 4 processor, features a 533 MHz system bus and up to 2 GB of high-speed DDR 333/266/200 memory. Intel® Extreme Graphics 2 technology enables intense, realistic 3D graphics and an AGP 4X interface enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams.

Intel® 852GME Chipset

Chipset Diagram

Features and benefits
533/400 MHz system bus Supports 533/400 MHz system bus for single processor configurations.
Supports up to 2 GB of DDR 333/266/200 memory technology Higher performance & flexibility.
Integrated Low Voltage Differential Signaling interface (LVDS) Higher integration which saves board space. Supports up to 1600x1200 UXGA+ panel resolution.
Dual independent pipe for dual independent display View 2 independent images on different displays.
Screen image rotation Ability to rotate the screen image 90°, 180° or 270°.
6 USB 2.0 ports. Backwards compatible to USB 1.1 High-speed USB 2.0 peripheral support.
Low power design Advanced mobile power management.
Intel® Extreme Graphics 2 technology Delivers intense, realistic 3D graphics with sharp images and enables balanced memory usage between graphics and system for optimal performance.
AGP 4X interface Provide the advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams.
Enhanced Intel SpeedStep® Technology Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life.
Deeper sleep alert state Dynamic power management mode operates at lower voltage than deep sleep mode for longer battery life.
Ultra ATA/100 Takes advantage of the industry innovations in HDD features and performance.
Thin and small package technology Intel® 852GME chipset uses Intel's Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability.
Packaging information
82852GME (MCH) 732 pin Micro-FCBGA
82801DBM (ICH4-M) 421 pin Micro-BGA