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Optimize data center power management with Intel® Node Manager and manage power and cooling resources.
Intel® QuickPath Inteconnect enables high performance communications in the latest generations of Intel® microarchitecture.
Introducing 3-D transistors manufactured at 22nm for future microprocessor families, continuing pursuit of Moore's Law.
Presentation: Innovations in 22-nm transistor technology include tri-gate transistors, which improve performance and energy efficiency.
Presentation: Tahir Ghani (Intel) reviews traditional‐scaling, modern innovations and future challenges and options for Nano‐CMOS Transistor Scaling.
Architectures Software Developer's Manual: Intel® 64 and IA-32 includes supporting processors programming environment and architecture.
Get realistic graphics with Intel® visual technology, integrated in 3rd generation Intel® Core™ processors.
Intel® Intelligent Power Technology conserves energy and increases server performance by delivering intelligent, efficient power management.
Video: BLOODHOUND SSC manages calculations behind car propulsion systems with three Intel® Atom™ chips.
Video: Intel® Atom™ platform presentation at IDF 2011.
Video: Product Manager Netbooks and Tablets Group Larry Chao overviews the tablets on display in the Intel booth at CES 2011.
Logic Paper: 32nm logic technology for high performance microprocessors
Presentation of 32nm logic technology for high performance microprocessors featuring 2nd generation high-k + metal gate transistors.
Presentation: low power optimization for a 32nm SoC platform with 2nd generation high-k/Metal gate transistors.
Presentation: low power optimization for a 32nm SoC platform with 2nd generation high-k/Metal gate transistors.
Brief examines the impacts and benefits of RF CMOS technology scaling in high-k/Metal gate era for RF SoC (System-on-Chip) applications.
Presentation: 40nm gate length InSb P-channel strained QWFET for low-power logic apps, including advantages, materials, and benchmarking.
Record NMOS and PMOS drive currents are reported, along with the tightest contacted gate pitch for a 32nm or 28nm technology.
Paper: non-planar, multi-gate InGaAs QWFETs with high-K gate dielectric and ultra-scaled gate-to-drain and gate-to-source separations of 5nm.
Presentation: Intel introduces a fundamentally different technology for future microprocessor families, 3D transistors manufactured at 22nm.
Video introduces Jasper Forest: the newest addition to the Intel® Xeon® processor family.
Covers how Intel® HD Boost accelerates digital multimedia tasks with new SEE4 instructions and optimization, enabling 50 percent better performance.
Discusses 64-bit desktop computing benefits from more physical and virtual applications.
Integrated memory controller animated demo explains how microarchitecture redesign increases performance and reduces latency.
White Paper discusses Intel® Microarchitecture (Nehalem), the basis for the Intel® Xeon® processor 3500 and 5500 series.