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Motherboard Mechanical Layout Tool (MBMLT)

Five minutes is all you need to design a better board by reducing the risk from mechanical shocks

Launch this easy-to-use interactive tool in order to:

  • Reduce platform controller hub (PCH)/chipset ball grid array (BGA) solder joint shock-related failure risk
  • Get predicted relative mechanical shock risk information
  • Find PCH/chipset locations with favorable mechanical shock response

 

This tool provides relative risk information1 for the Intel® 6 Series Express Chipsets (formerly Cougar Point) coupled with 2nd generation Intel® Core™ processors (formerly Sandy Bridge) on a 0.062-inch thick uATX motherboard (formerly Sugar Bay variant layout) subjected to a 50-g trapezoidal shock stress.

 

Access technical content and learn more about 2nd generation Intel® Core™, Intel® Pentium®, and Intel® Celeron® processors with Intel® Q67/B65/H61 Express Chipsets.

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1. Relative mechanical shock information should be used in conjunction with other considerations, such as electrical routing, signal timing, and thermal cycle stress, to design the board.