Explore cloud computing solutions built on Intel®-based technology. Learn the fundamentals, plan your solution, and decide on the technology you need.
Find out how to simplify delivery of your cloud services with Intel®-based technology. Learn the fundamentals of cloud computing, plan your solution, and decide on the technology you need.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Chapter 3 Alumina and Leaded Molded Technology: Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel’s IC assembly manufacturing technology and process flow.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Chapter 7 Leaded Surface Mount Technology (SMT): A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Cloud computing technology: Intel helps to develop a cohesive set of open, well-defined cloud computing solutions across IT infrastructures.
To faacilitate better cloud computing technology and solutions, Intel created a vision for 2015 that involves a cohesive set of open, yet well-defined standards that operate across IT and cloud infrastructures.
Andy Butler from Gartner and Boyd Davis from Intel discussed servers, storage, and networking in the cloud in this virtual event.
Andy Butler from Gartner and Boyd Davis from Intel discussed servers, storage, and networking in the cloud in this virtual event. Listen to the Q&A and read the chat transcript, exclusively from the Intel® IT Center.
Solution Brief: China Telecom builds an Intel® Xeon® processor-based business platform resources pool, improving its server performance, computing density, and reliability for more convenient and cost-effective info services for customers.
White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.
Discusses strategy to scale effective computing capabilities while containing power and cooling costs with Intel® Xeon® and Intel® Itanium® processor-based servers, delivering massive performance increases, cost savings and energy efficiency.