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Cloud Computing Solutions from Intel

Explore cloud computing solutions built on Intel®-based technology. Learn the fundamentals, plan your solution, and decide on the technology you need.

ESD/EOS: Intel's Packaging Databook Ch. 6

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Shipping and Transport Media: Packaging Databook, Ch. 10

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Alumina and Leaded Molded Technology, Packaging: Databook Ch. 3

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Tape Carrier Package: Databook, Chapter 12

Packaging Databook, Ch 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Leaded Surface Mount Technology: Intel's Packaging Databook, Ch. 7

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Cloud Computing Technology by Intel

Cloud computing technology: Intel helps to develop a cohesive set of open, well-defined cloud computing solutions across IT infrastructures.

Intel Talk to an Expert Series: Converged Cloud with Gartner

Andy Butler from Gartner and Boyd Davis from Intel discussed servers, storage, and networking in the cloud in this virtual event.

China Telecom: Enhancing Service and Capabilities

Solution Brief: China Telecom builds an Intel®-based platform resources pool, boosting performance and computing density for information services.

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Solve Power and Cooling Challenges for Effective Computing

White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

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