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Semiconductor equipment, fab, sort, assembly, and test materials are repurposed through the Intel® Resale Management System.
Chart: lists supplier, model number, description, Ceid, wafer size, and functional area of Intel Resale Corporation Fab equipment.
Using ruggedized tablets and Ultrabook™ convertibles in manufacturing areas showed benefits in efficiency, accuracy, and savings.
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Case Study: By deploying PCs with Intel® vPro™ technology, Caszone hit a positive ROI of 160% in four years.
Case study: PDS uses PCs based on Intel® vPro™ technology for lower cost and easier infrastructure management.
Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.
Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.
Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.