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This 4-minute video describes integration of the Intel 115X-Land processors with the LGA115X Series sockets in a system factory to minimize handling damages to socket contacts. Various LGA processor insertion/removal tools are introduced.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Mandarin: Processor insertion guide for LGA115X socket independent loading mechanism.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
Processor insertion guide for LGA13XX socket independent loading mechanism, minimizing contact damage.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.