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This 10-minute video describes integration of the Intel 2011-Land processors with the LGA2011 Series sockets in a High Volume motherboard factory to minimize handling damages to socket contacts. Various LGA processor insertion/removal tools are introduced. The new ILM Cover is also introduced.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Processor insertion guide for LGA2011 socket independent loading mechanism, minimizing contact damage.
Mandarin: Processor insertion guide for LGA2011 socket independent loading mechanism.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.